News | PhotonFirst

December 2024 | Partnership with Siemens Cre8Ventures

Written by Jacco Overdulve | Dec 4, 2024 10:58:16 AM

PhotonFirst partners with Siemens in chip-based smart sensing solutions

PhotonFirst is excited to announce a strategic partnership with Siemens Cre8Ventures. This collaboration aims to integrate PhotonFirst's advanced chip-based smart sensing technology into Siemens' PAVE360 Aerospace and Defense Digital Twin Marketplace.

PhotonFirst's fiber optic sensors offer high-precision data collection utilizing advantages such as:

  • Resistance to harsh environments
  • Immunity to Electromagnetic Interference (EMI)
  • Multiple sensing points in 1 cable
  • High sensitivity

This makes them ideal for a variety of applications, such as structural health monitoring, vibration analysis, and temperature sensing. By combining PhotonFirst's sensor technology with Siemens' digital twin platform, companies can create more accurate and reliable simulations of real-world systems.

This partnership will enable:

  • Enhanced Data Accuracy: PhotonFirst's fiber optic sensing solutions will provide high-quality, real-time data to improve accuracy when integrated in Siemens' PAVE360 digital twins.
  • Improved Decision-Making: Using real-time, accurate data from our fiber optic sensors, customers can optimize their maintenance schedules, structural health insights, and extend lifetime of their assets
  • Accelerated Innovation: The collaboration will streamline the development and testing of new products and systems.

This partnership marks a significant step forward for both companies and the broader aerospace and defense industry. By combining their strengths, Siemens and PhotonFirst align their drive for innovation and delivering smart solutions.

For more information about our fiber optic sensing solutions, please click here.

Are you interested in learning more about PhotonFirst's FBG sensor technology and its potential applications?