At PhotonFirst, we are excited to share our experiences and successes from the recent PIC Summit Europe held in Eindhoven. The event, organized by PhotonDelta, was a significant gathering in the photonic integrated circuits (PIC) industry, and it provided us with an great platform to present our ambition, "Packaging the Future of PIC."
In Eindhoven, a city recognized for innovation, we came together with other industry leaders, entrepreneurs, and technology enthusiasts, all sharing a common passion for advancing integrated photonics. Our participation was highlighted by the presentation of Thijs van Leest, our R&D Director. Thijs inspired the audience with his insights into the benefits of integrated photonics-based fiber optic sensing systems, using real-world examples to illustrate their practical applications and the transformative impact across various sectors.
Our booth at the summit buzzed with activity and enthusiasm. Visitors were keen to learn about our latest developments, discussing potential applications and exploring how these innovations could revolutionize different industries.
The summit also opened doors to new partnerships and business opportunities. We engaged in many promising discussions that created the foundation for future collaborations, which we believe will drive growth and innovation in the integrated photonics sector.
We would like to say thank you to PhotonDelta for their excellent organization of the PIC Summit Europe, 2023 edition. The event was not only a showcase of technological developments but also evidence to the power of collaboration in innovation. A special thanks also goes to everyone who visited our booth and engaged with our team. Your support and interest help us to keep pushing the boundaries of what is possible in the world of integrated photonics.
For more information about our PIC Packaging Services, don’t hesitate to contact us directly at team@photonfirst.com or visit www.photonfirst.com/pic-packaging-services